

Product Description
Product Overview
The General Electric DS200TCCAG1B is a Common Analog I/O Board from the GE Mark V Speedtronic Series, designed for turbine control systems in industrial automation, particularly for gas and steam turbines. Manufactured by GE, now under Emerson Automation Solutions following the 2019 acquisition of GE Intelligent Platforms, this printed circuit board (PCB) resides in the R5 core of the Mark V panel, processing analog signals such as thermocouples, RTDs, milliamp inputs/outputs, and shaft voltage/current monitoring. It features a microprocessor-based design with PROM modules and is suited for power generation, turbine management, and process control applications, offering reliable signal processing in a legacy product line.
Technical Information
Item | Specifications |
---|---|
Manufacturer | General Electric (GE) / Emerson Automation Solutions |
Series | Mark V Speedtronic |
Model/Part Number | DS200TCCAG1B |
Description | Common Analog I/O Board |
Processor | 80196 Microprocessor |
Inputs/Outputs | Thermocouples, RTDs, 4-20 mA Inputs/Outputs, Shaft Voltage/Current |
Connectors | 2 50-pin (JCC, JDD), 1 3PL (to STCA board) |
Power Consumption | 0.5 A at 5 V DC |
Operating Temperature | 0 °C to +60 °C (32 °F to +140 °F) |
Weight | 1.36 kg (3 lb) |
Key Features
- Analog Signal Processing: Located in the R5 core, it receives signals from CTBA, TBQA, and TBCA terminal boards, handling thermocouples, RTDs, 4-20 mA inputs/outputs, and shaft voltage/current monitoring, with data written to the STCA board via the 3PL connector.
- Microprocessor Design: Features an 80196 microprocessor with multiple PROM modules for firmware storage, one side-view LED for status, and two 50-pin connectors (JCC, JDD) for interfacing.
- Configurability: Includes three hardware jumpers (J1, JP2, JP3) for enabling/disabling the RS-232 serial port, oscillator control, and factory testing, respectively, with settings configured via the HMI I/O Configuration Editor.
- Durability: Coated with a normal PCB coating for protection against dust and humidity, requiring a cool, clean environment to prevent microprocessor damage from excessive heat.